Papers-GenMik

List of Publication of GenMik members

2014

• Ojha, N., Zeller, F., Müller, C., & Reinecke, H. Experimental investigation of parameters affecting the µEDM of non-conductive AlN ceramics. Proceedings of 15th International Conference on Precision Engineering (ICPE 2014),. Kanazawa, Japan

• Ojha, N., Zeller, F., Müller, C. & Reinecke, H. Comparative Study on Parametric Analysis of μ-EDM of Non-Conductive Ceramics. Key Eng. Mater. 611-612, 693–700 (2014).

• Zeller, F., Ojha, N., Müller, C. & Reinecke, H. Electrical Discharge Milling of Silicon Carbide with Different Electrical Conductivity. Key Eng. Mater. 611-612, 677–684 (2014).

• Ojha, N., Zeller, F., Mueller, C. & Reinecke, H. Study on the Effect of Tool Polarity and Tool Rotation during EDM of Non-conductive Ceramics. Adv. Mater. Res. Vols. 944, 2127–2133 (2014). 
• Ojha, N., Mueller, C. & Reinecke, H. Parametric Analysis of µ-Electric Discharge Machining of non-conductive Si₃N₄. Appl. Mech. Mater. 564, 560–565 (2014).

2013

• Hartleb, W., Zou, P., Lienkamp, K. (2013) Micro- and Nanostructuring of Surfaces: Towards Biomedical Applications, IRTG Discussion meeting 2013, Schluchsee, Germany, Poster.

• Ojha, N., Hoesel, T., Zeller, F., Müller, C. & Reinecke, H. in Proc. 10th Int. Conf. Multi-Material Micro Manuf. (Azcárate, S. & Dimov, S.) 07, 978–981 (Research Publishing, 2013).

• Ojha, N., Hoesel, T., Müller, C. and Reinecke, H. Parametric analysis of Electric Discharge Machining of non-conductive ZrO₂, Materials Science & Technology 2013. Montreal, Canada 
• Ojha, N., Amayreh, M., Müller, C. & Reinecke, H. Thermo-mechanical simulation of the die-sinking EDM process in ANSYS, ANSYS Conference & 31stCADFEM Users´ Meeting 2013,

2012

• Zou, P., Hartleb, W., Lienkamp, K. (2012) It takes walls and knights to defend a castle – How the combination of antimicrobial and antibiofouling polymers might yield biofilm-resistant surface coatings, J. Mater. Chem., 2012, DOI: 10.1039/C2JM31695A
• Zou, P., Hartleb, W., Lienkamp, K. (2012) It takes walls and knights to defend a castle – How the combination of antimicrobial and antibiofouling polymers might yield biofilm-resistant surface coatings, IMTEK research day, Freiburg, Germany, Poster.
• Zou, P., Hartleb, W., Lienkamp, K. (2012) It takes walls and knights to defend a castle – How the combination of antimicrobial and antibiofouling polymers might yield biofilm-resistant surface coatings, Journal of Materials Chemistry, Gordon Research Conference 2012 Les Diablerets, Switzerland, Poster.
• N. Ojha, T. Hösel, C. Müller, and H. Reinecke, “Characterization of the conductive layer formed during µ - electric discharge machining of non-conductive ceramics,” inMaterials Science and Technology (MS&T) 2012, 2012, pp. 423–428.
• T. Soares, H. Mozaffari, H. Reinecke, “Thermodynamics of microstructures and a strategy for producing new surface materials by electroplating on heterogeneous structures”, in 9th International Symposium on Electrochemical Micro & Nanosystem Technology., EMNT 2012, Linz - Austria, 08/2012, booklet 4 - p7, and in 63rd Annual Meeting of the International Society of Electrochemistry., ISE 2012, Prague - Czech Republic, 08/2012. (POSTER)
•  T. Soares, H. Mozaffari, H. Reinecke “Thermodynamics of Interfaces and Generation of Microstructures at Grain-Boundaries on Cu-Zn Alloy Substrates”, in Electrochemistry 2012 - Fundamental and Engineering Needs for Sustainable Development., München - Germany, 09/2012, p314 - G006. (POSTER)
•  T. Soares, H. Mozaffari, H. Reinecke “Kinetic Investigation of a Mechanism for Generating Microstructures on Polycrystalline Substrates Using an Electroplating Process”, in COMSOL Conference Europe 2012, COMSOL 2012, Milan – Italy, 10/2012 (PAPER, POSTER and PRESENTATION)
• S. Bödecker, T. Soares (2012, August) Smart Materials: Die Zukunft in der Werkstofftechnik (Medizin & Technik 04/12) [Online]. Available: http://www.medizin-und-technik.de/home/-/article/33568401/37427632?returnToFullPageURL=back; (ARTICLE IN MEDICAL MAGAZINE)
• F. Lima, U. Mescheder, H. Reinecke ‘Simulation of Current Density for Electroplating on Silicon Using Hull Cell‘, Proceedings of the 2012 Comsol Conference in Milan, Italy (2012)
• F.G.C. Lima, A. Filbert, U. Mescheder, H. Reinecke , ‘Investigation of Adhesion for Seedless Electroplated Copper Thin Films onto Silicon , ‘ Electrochemistry 2012, Book of Abstract, Munich, Germany (2012), p.246
• T. Tawakoli, A. Zahedi, J. Akbari, " Analytical Modeling of the Forces and Surface Roughness in Grinding Process with Microstructured Wheels," Submitted for publication .

2011

• A. Zahedi and J. Akbari, "FEM Analysis of Single Grit Chip Formation in Creep-Feed Grinding of Inconel 718 Superalloy," Adavnced Materials Research, vol. 325, pp. 128-133, 2011.
• Dorner, F., Hartleb, W., Zou, P., Ehm, W., Lienkamp, K. (2011) Micro- and Nanostructuring of Surfaces: Towards Biomedical Applications, SoMaS School Mittelwihr, France, Poster.
• Dorner, F., Hartleb, W., Zou, P., Ehm, W., Lienkamp, K. (2011) Micro- and Nanostructuring of Surfaces: Towards Biomedical Applications, IMTEK research day, Freiburg, Germany, Poster.